Infrastructure
SK Hynix breaks ground on Indiana high-bandwidth-memory packaging plant
Image: Primary SK Hynix has broken ground on a more than $4 billion plant in West Lafayette, Indiana, which the article describes as its first US base for high-bandwidth-memory packaging. The 133.5-acre facility is expected to employ about 1,000 people. The company said the cleanroom should open by October 2028 and mass production of next-generation HBM should begin in the second half of 2029. The project remains years from production.
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