$100 billion will go to U.S. chip manufacturing in TSMC's latest pledge

Taiwan Semiconductor Manufacturing Co. Chairman C.C. Wei announced Thursday an additional US$100 billion investment in the United States, bringing the company's total commitment in Arizona to US$265 billion. Wei made the pledge at the chipmaker's second-quarter earnings conference. The U.S. Department of Commerce said separately that the investment would add four advanced semiconductor manufacturing facilities, bringing TSMC's planned U.S. presence to 12 leading-edge semiconductor and packaging facilities. U.S. Commerce Secretary Howard Lutnick said the latest investment would create tens of thousands of American jobs and help bring advanced semiconductor manufacturing back to the U.S. American Institute in Taiwan Director Raymond Greene welcomed the plan, describing it as a sign of confidence in bilateral ties. Wei said the additional investment would fund logic wafer fabs using 2-nanometer and more advanced processes, as well as advanced packaging facilities, to meet strong multi-year demand from leading U.S. customers. Wei did not provide a firm timetable for the new investment pledge, saying progress would depend on market conditions and customer demand, although TSMC would seek to proceed as fast as possible. Prior to the new pledge, TSMC had committed to US$165 billion to build six fabs, two packaging plants and one R&D center in Arizona.